The IC card substrates produced by HENGHUI are widely used in telecom, banking, mobile payment, military industry, aerospace, social security, health,education, transportation, logistics, food , public safety ,etc. At present, we have dosens of patents and won unanimous recognition from worldwide customers with excellent service and perfect after sales .
HENGHUI provides customers with smart card module and testing services which include contact,contactless and dual interfaces IC card module. HENGHUI is committed to promoting the application,development and manufacturing of module products in the fields of telecom, banking, transportation, security recognition and IOT.
HENGHUI Technology provides 12-inch, 8-inch and 6-inch wafer thinning and scribing services to customers. It has formed a one-stop industrial service chain from wafer thinning and scribing, module packaging and testing and core materials in one, providing customers with comprehensive, professional and fast services.
The high precision etching metal lead frame branch factory of HENGHUI Technology is equipped with 23000m² production workshop and supporting utilities equipment, using self-developed production technology, customized introduction of international advanced production and testing equipment and instruments, products cover QFN, DFN, SOP, DIP, FC and other hundreds of models, the current production capacity of up to 30 million per year, products break the international monopoly, fill the gaps in the country, widely replace the import, and is committed to first-class products and services to continue to create value for customers.
HengHui provides customers with IoT consumer-grade and industrial-grade chip card packaging test and personalized writing services, with a current monthly capacity of 35 million pieces, committed to creating high-quality products and first-class service for customers.
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